Texprocess 2017 in Frankfurt am Main

von | Apr 6, 2017

ComDi FASHION is participating at Texprocess, the international trade fair for the garment-manufacturing and textile processing industry, for the third time. The fair takes place from 9 to 12 May 2017 in Frankfurt am Main (Germany). ComDi FASHION is showcasing the unique ComDi-Clip slide closure and other exclusive products, which provide highest comfort. The European patent EP2775873 for the slide closure has been published since February.

Additionally, we have enhanced and improved the slide closure based on feedback from our customers, so that it now is even smaller and more flexible. Furthermore, we have developed an additional component, which we will present for the first time at the trade fair. This component now completes the overall functionality.

We would like to invite you to our booth. You can find us in Hall 5 on Level 1 at Booth C28. We are available from 9:00 to 18:00 and would be pleased to meet you in person!

Further information about the fair: Texprocess 2017
You can contact us via e-mail: info@comdi-fashion.de

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